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  1. #1
    Simon Templar
    Guest
    DaveC wrote:
    > Are there updates available for Nokia phones? Or doesn't Nokia update
    > software?
    >
    > I've got a 6200 with v4.22. Is there a newer version than this?
    >
    > Thanks,


    http://www.mobiledia.com/forum/topic25335.html




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  2. #2
    Your name
    Guest

    Re: Software updates for Nokia phones?

    Brian Morrison <[email protected]> wrote in news:L8-
    [email protected]:

    > DaveC wrote:
    >> Are there updates available for Nokia phones? Or doesn't Nokia update
    >> software?
    >>
    >> I've got a 6200 with v4.22. Is there a newer version than this?

    >
    > Not up to July 1st this year, but there might have been one since then.
    >
    > It looks like a fairly mature phone, they tend not to get many updates
    > after a year or so.
    >


    Yes, Nokia does update software--but only for software related problems or
    complaints unless they have changed policy since the first of the year.
    Some software revisions require changes to components on the boards and
    with nearly all large chips being BGA now, changing components is a little
    risky as all of the major chips come with one of the allowable heat cycles
    already used at manufacture--most only allow 3 heats. Heats are counted
    so: component placed and heated to melt solder and form connection to
    board contacts = 1 heat, board heated to remove component then adjacant
    components get a "heat", this makes two; new component placed and heated
    then adjacant components get another heat. Total for adjacant components:
    3 heats. For all practical purposes the phone is now a walking casualty
    and may or may not live out its full life. If the phone passes ops and RF
    tests it is sent to the customer, but if it comes back in it is likely to
    be replaced because of the number of heats it has already seen. Good techs
    check the past history of the phone, bad or slopy ones don't so the
    customer may get his now 5 heated phone back if the tech changed something
    that required a BGA component. (BGA--ball-grid array, all contacts are on
    the bottom of the component and are supplied with a little solder ball
    attached to the contact. This requires the entire component to be heated
    to about 450 F to melt the solder ball reliably and form the contact with
    the board, thus the "heat" cycle count requirement)

    A little long-winded and probably more tha you wanted to know but hope it
    helps.

    Ron
    (Ex-Nokia tech)



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